AI chips are moving off round wafers and onto rectangular‐panel packaging

From $160M today → $650M by 2030. Big integration & materials play. Are you ready for panel‑level packaging?

AI chips are moving off round wafers and onto rectangular‐panel packaging. from $160M today → $650M by 2030. Big integration & materials play. Are you ready for panel‑level packaging?

Why it matters: according to EE Times, tool & material suppliers (Lam Research, Nikon) anticipate a panel‑level packaging shift to rectangular formats (300‑600 mm panels) driven by HPC/AI demand — impacting packaging, test, substrate, materials.

Industry & Market Signals: Science × Policy × Capital

Read our quarterly round-up. Our take: the stack is coalescing—hardware, algorithms, and deployment pathways are aligning with policy and regional strategies.

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October 27, 2025

Quantum just had its “two-hour mile” moment

Harvard and MIT researchers have built a quantum computer that ran continuously for two hours — a 55,000% leap from the millisecond lifetimes we’re used to.

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October 2, 2025

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AI chips are moving off round wafers and onto rectangular‐panel packaging

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Industry & Market Signals: Science × Policy × Capital

Quantum just had its “two-hour mile” moment

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